TSMC has reportedly accelerated the timeline for its second fab in the US state of Arizona and will begin installing the necessary equipment for it to start cutting its 3nm nodes, sometime in the middle of next year. If it isn’t already obvious, its reason for bringing its roadmap forward is in anticipation of further Trump tariffs.
As a quick primer, TSMC had initially planned to bring its 3nm process into mass production by 2028. By bringing up the timetable of the second fab’s construction and in for doing so, bringing up the timeline for said production of chips, would mark a significant milestone for the semiconductor maker.
As it is, TSMC is prepared to raise the production costs of its current lithography by 15%, should such tariffs be implemented.
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