The chip set to power the Sony PlayStation 6 (PS6) is reportedly nearing completion, if the words of a reliable leakster are to be believed. Supposedly, the chip has already entered the pre-silicon validation phase, with its “A0 tapeout” scheduled to occur later this year.
Updates on the alleged status of the PS6 chip were mentioned by KeplerL2 who, surprisingly, made the most on NeoGaf, rather than their usual haunt on X. If true, then it speaks volumes of Sony’s timeline and roadmap for it its products.
Given that a A0 tapeout phase typically begins around two years before a final product is released, we could see the PS6 hit the consumer market as early as 2027 but as these things usually go, fingers crossed that there are no delays.
Sony recently refreshed its PlayStation lineup with the PS5 Pro. While the console is certainly more powerful than the standard PS5 thanks to its bigger APU, it is also more expensive at RM3,849. Despite the larger price tag, the console is reportedly doing well in the market.
Given its close relationship with red chipmaker AMD, the PS6 chip is expected to be based on AMD’s Zen6 CPU architecture made with TSMC’s 3nm process, while GPU is expected to based on AMD’s UDNA architecture. Additionally, it has also been rumoured that the new APU could make use of AMD’s 3D V-Cache technology.
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