MediaTek has just lifted the veil on its newest flagship mobile SoC, the Dimensity 9300. This comes just a couple of weeks after Qualcomm announced the Snapdragon 8 Gen 3, pitting the chipsets against each other in the coming batch of high-end smartphones.
The Dimensity 9300 is equipped with eight ARM cores comprised of four Cortex-X4 and four Cortex-A720 processors, clocked at 3.25GHz and 2.0GHz respectively. When it comes to performance boosts, the company claims that it has 15% better single-core performance and a staggering 40% upgrade for multi-core performance. It also gets an 18MB L3 + SLC cache, which is 29% larger than its predecessor.
On the efficiency side, it claims that the 3rd generation TSMC 4nm chip production technology and the thermal optimised design allows the Dimensity 9300 to save up to 33% more power in multi-core use. The power efficiency is also compounded with the faster LPDDR5T memory and UFS 4.0 storage with MCQ.
Of course, to truly compete with Qualcomm, the firm had to include generative AI support using a dedicated APU for a hardware-level generative AI engine, which is 45% more efficient while also being eight times faster. For gaming, the Dimensity 9300 features a 12-core GPU using the Immortalis-G720 architecture, which provides a 46% improvement in raytracing and 40% more power saving.
Its photography capabilities include support for camera sensors up to 320MP, with a max video capture resolution of 8K at 30 FPS and support for the new Ultra HDR format in Android 14. Last but not least, its connectivity features get upgraded to Wi-Fi 7 and Bluetooth 5.4.
The Dimensity 9300 is expected to debut in the vivo X100 series, which is set to go official on 13 November in China. OPPO confirmed that the new Dimensity chip will power the upcoming Find X7, but the X7 Pro is rumoured to feature Qualcomm’s SoC.
(Source: MediaTek)
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