It’s been a week since a full-on review of Intel’s 11th generation Core i7-11700K CPU by Anandtech was published, the renowned tech site having purchased the processor a full month ahead of the lineup’s official launch. Now, images of the CPU without its modesty-inducing lid and Thermal Interface Material (TIM) are beginning to appear online.
The image was first posted by MoBen over at Overclock – who also seems to have procured the 11700K through similar (German) channels such as Anandtech – and shows off the 11700K’s die in all its glory. It is reported that both the 11700K and last generation’s Core i9-10900K possess the same die size. However, by MoBen’s account and after a quick side-by-side comparison, they say that the 11700K is estimated to be between 260mm2 and 270mm2, making it approximately 28% larger.
Sadly for MoBen, the delidding process was not a successful one, meaning that they were not able to test the 11700K at all. That said, like all 11th generation Rocket Lake-S desktop CPUs, we know that the lineup will be the last to be based on Intel’s already archaic 14nm process node (backported from 10nm) but more to the point, it also finally supports the new PCIe 4.0 interface, which was first introduced by AMD and its Ryzen 3000 series CPUs and 500 series AM4 motherboard, back in 2019.
(Source: Overclock, Videocardz // Image: MoBen via Overclock)
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