Qualcomm announced that it has partnered up with BOE Technology Group, a company widely regarded as a leader in the semiconductor display industry. The goal of the partnership is to produce new flexible displays that feature the former’s 3D Sonic ultrasonic fingerprint sensors.
In light of the new partnership, Qualcomm has already begun working on incorporating its security feature into BOE’s flexible OLED panels. According to Qualcomm’s official statement, its partnership is intended to provide a more streamlined solution to OEMs. Allowing them to create new and unique devices in the future, possibly with a reduction in bureaucratic hassle.
For BOE, this also enables the company to offer displays that are already integrated with Qualcomm’s 3D Sonic fingerprint sensor. Further, selling displays with said technology also helps both companies to cut down on bill of materials (BoM), as well as research and development expenses.
Qualcomm says that it expects BOE’s displays with its 3D Sonic fingerprint sensors to begin widespread adoption on devices as early as the second half of 2020.
(Source: Qualcomm)
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