To counter the recently announced Qualcomm Snapdragon 710, Huawei through its subsidiary HiSilicon is planning a new mid-range chip. According to a recent report, the chip will be called Kirin 710 and will be built on a 12nm process.
Featuring ARM Cortex-A73 cores, the new Kirin 710 will be built at TSMC and comes with design improvements for better battery life. Other features of the chip also included NPU, previously seen on the higher end Kirin 970. The NPU is there to help with AI-related applications and provide neural network processing capabilities.
Huawei is expected to feature the new chip in the new Huawei nova 3, which is slated to be launched sometime later this year. While the official information regarding the phone is not yet known at the moment, it apparently will feature a 19.5:9 screen and dual cameras on the rear.
With the eight-core architecture and promised power consumption reduction, the Kirin 710 could become a rather fierce competitor to the Snapdragon 710 once it is out on the market.
(Source: Digitimes)
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