It looks like the Meizu Pro 6 is building up to be a very powerful smartphone. Earlier this week, rumours says that the device will feature 6GB of RAM with 128GB of storage and now, MediaTek just confirmed that it will be powered by the new Helio X25 chipset that is developed specially for the Meizu Pro 6.
Developed exclusively for the Meizu Pro 6, the Helio X25 SoC is basically an enhanced version of the 10-core Helio X20 chipset that was announced last year. It features the same tri-cluster design consisting of a low power quad-core A53 cluster clocked at 1.4GHz, a power/performance balanced quad-core A53 cluster clocked at 2.0GHz, and an extreme performance dual-core A72 cluster however, instead of 2.3GHz, it has been boosted to 2.5GHz. The Mali-T880MP4 GPU has been boosted up to 850MHz from 780MHz.
The Helio X25 also supports up to 25MP camera sensors or dual 13MP cameras, 2K and 4K video support at 30fps, fast charging via Pump Express 3.0+, Vulkan Graphics API, Cat 6 LTE network support and VoLTE.
The Meizu Pro 6 will be the first to use this chipset, and will have exclusive rights to the Helio X25 for several months. After that, other companies will be able to purchase the chip. The Meizu Pro 6 is expected to be launched later this year.
(Source: Android Authority)
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