Originally called SoFIA which stands for Smart or Feature phone with Intel Architecture, the new Intel Atom x3 processors were officially launched here at Mobile World Congress 2015 earlier this week. Made for the entry and value segment of the market, devices featuring these new processor will only be ready for consumers later this year but that doesn’t stop Intel from showcasing several reference design smartphones and tablets at its booth in MWC.
Unfortunately though, these devices were kept out of our curious fingers inside their display cases. Among reference design devices that were on display came from Intel itself together with several of the company’s original design manufacturer (ODM) partners such as Blubank, BYD, ECS, Foxconn, and Tsinghua TongFang.
While Intel reference devices are meant for manufactures, you might be able to get your hands on these ODM devices in the market in the near future although with different brand names as ODMs design and build them for other companies. Given how thriving is the entry and value level market in Malaysia, the possibility to see them might be even higher.
READ MORE:
MWC 2015: INTEL UNVEILS NEW LINE OF MOBILE ATOM PROCESSORS
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